Provide card milling and chip embedding technical support and assistance to card manufacturing customers to successfully integrate the Companys chip products into customers card manufacturing process.
Work closely with internal product engineering team to classify chip embedding difficulties and identify fixes for customers card manufacturing processes.
Conduct training and lead discussion with product engineering team on new equipment and processes used to perform chip embedding on smart card.
Collaborate with internal teams and external vendors to define user and technical requirements and needs.
Perform feasibility studies to validate card milling and chip embedding capability and functionality.
Keep the team updated on latest materials, technologies, and equipment in the market.
Develop internal technical and domain expertise on card milling and chip embedding processes.
Job Requirements:
Degree/Diploma in Mechanical Engineering or equivalent.
Fundamental knowledge and skills in smart card milling and chip embedding (implanting) process is preferred
Experienced in soldering processes, different types of solder, leaded or unleaded, and the different melting points for different applications is preferred
Additional knowledge or experience in any of the following is an advantage:
Other smartcard manufacturing process knowledge or experience, such as printing, lamination, ID-1 punch, and or Personalization (i.e. hot stamping, embossing, etc.);
Knowledge or experience in PVC/ABS/PET materials used in the lamination process to manufacture smartcard, as well as special materials such as holo-foil, metal, special ink, etc.; or
Knowledge or experience in working with different types of hot melt lamination tape used during embedding, high/low temp and different brands, i.e. Tesa/Carde/Nitto/Larsen/Scalpa, etc. as well as understanding of the fundamentals behind different hot melt materials.