Leads the R&D team tape and Modules to deliver new products, on time, under budget and Yield targets
Leads and manages the new product development process and manages new ideas explorations/testings
Develop technical benchmarks against key competitors and identify emerging or advanced technologies to improve competitive position. Proposes new R&D exploration and development to bring to next level
Supports field sales and improves the technical understanding of the subject product/ solutions lines
Providing expertise in R&D, product development, asset management and value chain delivery to support business strategy on the new product introduction
Research and deploy new technologies in new and existing product lines, with a focus on PRIEMIUM products
Collaborates with related product lines to define projects and products and to support definition of product strategies, e.g. roadmaps, platforms
Effectively balancing sales priority & resource availability to deliver multiple development projects concurrently
Supporting the supply chain function with existing product requirements and taking an active role in the introduction of new suppliers where necessary in line with new product development portfolio requirements
Collaborates with executive Management on strategic planning, owns and identifies investment needs
Create and implement resource plans to account for new products development and new skills development
Responsible for roadmap definition and execution on module packaging smartcard
Responsible to bring new products into business, design, concept definition, coordination and work with stakeholders (program, project Managers, purchasing, operations)
Responsible to build Proof of Concepts samples, and exploration samples in order to create ideas of product/process innovation in Smartcard
Competency in microsystems technology, micro-electronics packaging, Smartcard packaging and advanced packaging electronics, and if possible in RFID/RF design and engineering
Competency in new product design in electronics/hardware/PCB innovation
Requirements:
Degree in the field of microsystems technology, electrical engineering, materials engineering, or an equivalent education. Expertise in RFID/HF would be an advantage
Significant experience in leadership of technical R&D and/or product development teams
Good communication skills
Team Player Attitude
Time Management Abilities
Problem-Solving Skills and organizing priorities/focus